Skip to content

HiSilicon Kirin 650 Specs

HiSilicon Kirin 650 specs, benchmark, performance, architecture, memory and all chipset specifications and technical features.

HiSilicon

⚙️ Specs

HiSilicon Kirin 650
ManufacturerHiSilicon
ChipsetKirin 650
Other names/codenameHi6250, Honor KIRIN650
Release date4/1/2016
Maximum clock support2GHz
Total of cores8
CPUOcta-core, 2 processors:
4x 2GHz ARM Cortex-A53 (Quad-core)
4x 1.7GHz ARM Cortex-A53 (Quad-core)
GPU (graphics card)ARM Mali-T830 MP2 (900MHz)
Transistors size (nanometers)16 nm
Architecture64bit, ARMv8-A (A32, A64)
Level 1 Cachefeature not registered
Level 2 Cachefeature not registered
Level 3 Cachefeature not registered
RAM memory typesLPDDR3

➕ Other features

HiSilicon Kirin 650
• SoC FinFET process
• 4G LTE Cat6 (300 Mbit/s)
• LPDDR3 2x32bit (933MHz)
• Bluetooth 4.1
• eMMC 5.1


X

We use cookies to provide and improve our services. By using our site, you consent to cookies. See more details: Privacy policy.